LiquidStack Engineering Center
Agile global Engineering Center with fast prototyping & light production capabilities
LiquidStack Cooled the Most Energy-Efficient Liquid Cooled Data Center in 2013
Since designing and building the liquid cooling technology of the most energy-efficient data center in Asia, we have worked with global leaders to define the next generation of advanced data center cooling solutions for HPC, edge deployments and hardware manufacturers.
Build and test your next-generation liquid cooled data center or hardware solution in our Engineering Center.
The Blueprint for Best-in-Class Energy-Efficient Data Centers
Build Your Next Energy-Efficient Data Center with LiquidStack
The Hong Kong Data Center serves as the field-tested and proven blueprint for building greenfield data centers that defy the cooling convention:
- Game-changing electricity savings: The Hong Kong Center achieves 99% savings on cooling electricity versus HKG average
- Exceptional PUE in challenging climates: 1.01 PUE versus HKG average PUE of 2.20 and HKEX PUE of 1.60
- Unmatched rack density and modular design: Customers benefit from proven innovations – 18-225kW per rack
- Agile and seamless construction: No raised floor or high ceiling requirement
- Sustainable and environmentally-friendly data center design: Silent and dust-free, no moving parts
Awards
Best Green ICT Awards 2014
Data Center Dynamics Awards 2014
Hong Kong Green Innovations Awards 2014
Hong Kong Most Valuable Services Awards 2018
Data Center Dynamics Awards Finalist 2020
Meet Kar-Wing Lau
His innovative thinking about cooling technologies sounds like science fiction. Nothing could be further from the truth.
See how he led a team of engineers to create the next revolution in liquid cooling, which is now changing the game for data centers worldwide.
Custom Cooling Solutions for Semiconductor and Hardware Operators
As users of liquid cooling ourselves, we understand what our customers need. In 2012, our data center in Hong Kong couldn’t run at maximum capacity due to the limits of our air cooling system. With 6048 FPGA chips, combining 890 million logic cells, operating in the hot and humid Asian climate, traditional air cooling systems could no longer keep the equipment cool enough to perform optimally.
So we pioneered the technology.
